Chip manufacturing latest achievements
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Section C for Power Distribution of...
Construction time: January 17, 2020 - May 31, 2021
Building area: FAB main plant: 278,000m², total project land: 1,145,000m²
Clean area: 73,000m²
Cleanliness level: Class 1,000
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Chongqing No. 26 Institute Filter R...
Construction time: August 26, 2020 - September 30, 2021
Building area: The total building area is 27,870㎡
Clean area: 10,400㎡
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Guangzhou CanSemi 12-inch Integrate...
Construction time: January 10, 2019 - December 31, 2019
Building area: 59,000㎡,Clean area: 17,000㎡
Cleanliness level: Class 100 - 1,000
Scope of contracting: purification and electromechanical engineering
Project process equipment: Mask aligner
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Huahong Wuxi FAB7 Phase III Machine...
Construction time: May 30, 2020 - December 30, 2020
Building area: 130,000㎡
Clean area: 28,000㎡
Cleanliness level: Maximum Class 1
Scope of contracting: Huahong Wuxi FAB7 Phase III Machine Power Secondary Distribution Project
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Beijing SMIC Fab2 P2 Tianshan Proje...
Construction time: March 1, 2020 - October 30, 2020
Building area: 89,555㎡
Scope of contracting: Power-related Expansion of SMIC North P2B Tianshan Project Team
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Quanzhou Sanan Semiconductor Techno...
Construction time: April 2020 - Present
Building area: 16,900㎡,Clean area: 15,900㎡
Cleanliness level: Class 100/1,000/10,000
Scope of contracting: Quanzhou Sanan GaN Area 2# Houdao Plant HVAC and Purification Decoration Project
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Huahong Semiconductor (Wuxi) Co., L...
Construction time: December 10, 2018 - June 15, 2019
Building area: 130,000㎡
Clean area: 28,000㎡
Cleanliness level: Maximum Class 1
Scope of contracting: Huahong Wuxi Phase I CUB Plant, F1 Plant Cleaning and Purification, as well as Electromechanical Engineering
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Central Semiconductor Manufacturing...
Project address: Jiangsu
Construction time: July 31, 2019 - August 1, 2020
Building area: 33,000㎡
Clean area: 7,400㎡
Cleanliness level: Maximum Class 1
Scope of contracting: general contracting of construction
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Tianjin SMIC Tianxiang Project Phas...
Construction time: September 1, 2020 - January 30, 2021
Building area: 230,000㎡
Clean area: 74,000㎡
Cleanliness level: Class 100
Scope of contracting: Tianxiang Phase II cleanroom and electromechanical engineering
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SINO Crystal Electromechanical Inst...
Construction time: June 15, 2020 - December 15, 2020
Building area: 82,000
Clean area: 25,000
Cleanliness standard: Class 1 - 100,000
Scope of contracting: building electromechanical installation
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Hefei Nexchip Semiconductor Corpora...
Construction time: March 2016 - July 2017
Building area: 210,000㎡
Clean area: 30,000㎡
Cleanliness level: Class 10 - 1,000
Scope of contracting: MEP
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Nepes 1# Plant Dust-free Workshops
Construction time: January 2015 - June 2015
Building area: 11,000 (10,000㎡)
Clean area: 6,000 (10,000㎡)
Cleanliness level: Class 100 - 1,000
Scope of contracting: construction and electromechanical installation of dust-free workshops
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Xi'an Samsung FAB Building Vent...
Construction time: June 1, 2013 - December 31, 2013
Building area: 36.4 (10,000㎡)
Clean area: 15.5 (10,000㎡)
Cleanliness level: Class 1,000
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