Construction time: January 10, 2019 - December 31, 2019
Building area: 59,000㎡,Clean area: 17,000㎡
Cleanliness level: Class 100 - 1,000
Scope of contracting: purification and electromechanical engineering
Project process equipment: Mask aligner
This project is a first-class IDM at home and abroad that provides value services for the development of the IoT and automotive electronics.
Project highlights:
Guangzhou CanSemi Project is the first 12-inch chip factory in China with virtual IDM as its operating strategy, and it is also the first 12-inch chip production line in Guangzhou. The investment in the project is RMB 7 billion, and the newly built plant and supporting facilities covers a total area of 140,000m2. After being constructed and put into operation, CanSemi would achieve a monthly production capacity of 40,000 12-inch wafers. Its products include microprocessors, power management chips, analog chips, power discrete devices, etc., which meet the needs of IoT, automotive electronics, AI, 5G and other innovative applications.
Gathering excellent technical management teams from the United States, Singapore, Taiwan and the Chinese Mainland, with its refined, differentiated and customized operational positioning, CanSemi takes the first step for Guangzhou's chain link semiconductor industry through combining the resources of chip design, packaging and testing, terminal applications, industrial funds, etc.
Aerial view
Live view
Project awards
Awards and honors: this project won the honorary title of "Guangzhou Civilized Construction Site";