Semiconductor (Materials and equipment)

Qidong Jiejie Microelectronics Phase II Packaging Project

Construction time: July 1, 2020 - September 30, 2020

Building area: 7,000㎡,Clean area: 6,000㎡

Cleanliness level: the maximum dynamic Class 1,000

Scope of contracting: Qidong Jiejie Microelectronics Phase II Packaging Project Clean and Electromechanical Engineering

Project highlights:this project is about the procurement and supply, transportation (including secondary lightering), unstuffing and unloading, insurance, warehousing, placement, installation and commissioning, trial operation, cooperative acceptance, training, after-sales service, spare parts, special tools, defects liability period, quality guarantee period, and other related services of the corresponding cleanrooms and general electromechanical systems. These systems include but are not limited to: cleanroom environment system, cleanroom fresh air treatment system, cleanroom air supply and return system, process exhaust system, process cooling water system, process vacuum system, electrical system, FMCS, water supply and drainage system, smoke control and extraction system, and air conditioning hot and cold water piping system, and construction and decoration system.

Industry value:Founded in 1995, Jiangsu Jiejie Microelectronics Co., Ltd. a high-tech enterprise in Jiangsu Province that specializes in the R&D, manufacture and sales of semiconductor discrete devices and power electronic components. It is an innovative enterprise in Jiangsu Province, a member unit of China Semiconductor Industry Association, and advanced member unit of the Power and Electronics Branch of China Electrical Equipment Industry Association. The company has established "Jiangsu Enterprise Technology Center" and "Jiangsu Engineering Technology Research Center". It has first-class technological innovation ability, good market reputation and business network. It is a semiconductor manufacturer of thyristor devices and chip slicing IDM (integrated device manufacturer, that is to say, covering the entire chip industry chain, integrating chip design, manufacturing, and packaging and testing) in the field of power semiconductor devices in China.

 

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