Construction unit: Beijing Chip Advanced Technology Inc
Project location: Haining Economic Development Zone, Zhejiang Province
Service content: scheme design, construction drawing design
Project investment: RMB 120 million
Construction scale: building land: 28.64 mu; building area: 31,500㎡; Cleanroom area: 24,000㎡
Construction period: January 2019 - July 2020
Project product: integrated circuit chip packaging and testing