Construction unit: Beijing Chip Advanced Technology Inc

Project location: Haining Economic Development Zone, Zhejiang Province

Service content: scheme design, construction drawing design

Project investment: RMB 120 million

Construction scale: building land: 28.64 mu; building area: 31,500㎡; Cleanroom area: 24,000㎡

Construction period: January 2019 - July 2020

Project product: integrated circuit chip packaging and testing